-
Blind and Buried Vias: What Are They and How Are They Used?
Introduction In the ever-evolving world of printed circuit board (PCB) design, the demand for higher […]
-
Black Pad and Electroless Nickel and Immersion Gold (ENIG): A Comprehensive Analysis
Introduction Electroless Nickel and Immersion Gold (ENIG) is a widely used surface finish in the […]
-
Bill of Materials Management: A Comprehensive Guide to Efficiency and Accuracy
Introduction In the world of manufacturing and product development, the Bill of Materials (BOM) is […]
-
Bill of Materials for PCB: Part Numbering Systems and Organization, or Packing Tetris?
Introduction The Bill of Materials (BOM) is the backbone of any Printed Circuit Board (PCB) […]
-
Bil Herd and the Commodore Chip Fab: A Journey of Innovation and Legacy
Introduction Bil Herd is a name synonymous with innovation in the world of personal computing, […]
-
A Big Kick in PCB Interconnect Solutions: Multi-Board Best Practices
Introduction In the ever-evolving world of electronics, the complexity of devices continues to grow, often […]
-
BGA Fanout Routing: Best Practices and Techniques
Introduction Ball Grid Array (BGA) packages have become a cornerstone in modern electronics design due […]
-
Beyond the Drawing Board: A Lesson Learned in Flex Design
Introduction Flexible printed circuits (FPCs), commonly referred to as flex circuits, have become increasingly popular […]
-
Best Practices for Using PCB Reference Designs
Introduction Printed Circuit Board (PCB) reference designs are invaluable resources for engineers and designers, providing […]
-
Best Practices for Using Schematic DNI/DNP Entries in Your PCB BOM
Introduction In the realm of Printed Circuit Board (PCB) design, the Bill of Materials (BOM) […]
RigidFlexPCB
Archive
Categorise
Recent Posts
- Blind and Buried Vias: What Are They and How Are They Used?
- Black Pad and Electroless Nickel and Immersion Gold (ENIG): A Comprehensive Analysis
- Bill of Materials Management: A Comprehensive Guide to Efficiency and Accuracy
- Bill of Materials for PCB: Part Numbering Systems and Organization, or Packing Tetris?
- Bil Herd and the Commodore Chip Fab: A Journey of Innovation and Legacy
